The first rumors regarding Apple’s switch from printed circuit boards to SiPs dates back to mid-2014 when the Apple Watch was still referred to by the industry as the “iWatch”.
Sure enough, the Watch was indeed powered by a SiP rather than a more conventional PCB (Printed Circuit Board), and as some of you might be aware of, back in March we also heard that the upcoming iPhone line-up could make use of the same technology.
Now these rumors have made a comeback as supply chain sources cited by ChinaTimes now claim that the iPhone 6s will make “extensive” use of SiP modular architecture.
Join us after the break for more details!
![System-in-Package[1]](http://www.gforgames.com/wp-content/uploads/2015/03/apple-headquarters1.jpg)
iPhone 6s to use SiPs
SiP stands for “System in Package” and refers to a single “package” that contains numerous components such as a processor, RAM, storage, and even sensors. Compared to conventional printed circuit boards, SiPs are much more compact and can contribute to a thinner end product (in this case smartphone).
Apple used SiPs in the production of the Watch, and apparently the Cupertino-based company is very pleased with the results, so much so that Apple is now believed to use SiP modular architecture in the production of the iPhone 6s too. In other words, Force Touch might not be the only technology to debut on the Watch and cross over to the smartphone segment by the end of 2015.
According to previous rumors we’ve unearthed a while back, this year’s iPhone 6s duo will still use a PCB (in conjunction with probably several SiPs), while in 2016 Apple plans on entirely eliminating the PCB from its smartphones. If that will be possible, we’ll have to wait and see.
The source adds that the company’s production chain will begin manufacturing SiPs for the next gen iPhone this month, and that the iPhone 6S will be introduced by the end of September or sometime in early October (as opposed to what everyone’s favorite Apple analyst seems to think). With that being said, one can only hope that Apple will not run into issues of any kind, as using SiPs can also have a downside. Needless to say, if one internal module is faulty then the entire SiP is compromised and obviously this can lead to a lower yield than usual.